The insulation packaging of glass and metal is mainly used to protect internal electronic components, chips, or other sensitive components from external environmental factors such as moisture, dust, and corrosive gases, while achieving electrical insulation to prevent current leakage and short circuits. This type of packaging is widely used in many fields such as electronics, optoelectronics, aerospace, etc.
Electrical insulation performance testing:
Measure the insulation resistance of the packaged product using an insulation resistance tester to ensure it meets the design requirements. Generally speaking, the higher the insulation resistance, the better the electrical insulation performance. At the same time, a voltage withstand test will be conducted to check whether the package can withstand without breakdown by applying a voltage higher than the normal operating voltage.
Sealing test:
Use helium mass spectrometer leak detector and other equipment to check the sealing of the package. For some components that are sensitive to humidity and gas, good sealing can prevent moisture and harmful gases from entering the interior of the package. If a leak is found, it is necessary to re evaluate the packaging process and materials, identify the cause of the leak, and make improvements.
Thermal performance testing:
Evaluate the performance of the package under different temperature environments through thermal cycling testing. Cycle the package repeatedly between high and low temperatures, observe whether the bonding between glass and metal is firm, and whether cracks or separation may occur due to thermal stress. At the same time, the thermal conductivity of the package will be measured to ensure that it can effectively dissipate heat and meet the working requirements of internal components.
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